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I have created a larger heating surface, the total length is 3800mm, width 1.4mm and spacing 0.4mm.
My power supply can supply max 30A at 12V. The calculated resistance at 25 degrees is 1.36 ohms, then at 12V it is 8.8A. The board is therefore larger and gets about 220 degrees hot. As soon as I put a PCB on the plate it takes longer to heat up due to heat dissipation, which is normal. But I do not get to 200 degrees. How can I adjust my design so that the plate has a higher performance?
Is it useful to reduce the board resistance by making the trace wider? What would be useful here?
The text was updated successfully, but these errors were encountered:
I have created a larger heating surface, the total length is 3800mm, width 1.4mm and spacing 0.4mm.
My power supply can supply max 30A at 12V. The calculated resistance at 25 degrees is 1.36 ohms, then at 12V it is 8.8A. The board is therefore larger and gets about 220 degrees hot. As soon as I put a PCB on the plate it takes longer to heat up due to heat dissipation, which is normal. But I do not get to 200 degrees. How can I adjust my design so that the plate has a higher performance?
Is it useful to reduce the board resistance by making the trace wider? What would be useful here?
The text was updated successfully, but these errors were encountered: